Appropriate solvers are available depending on types or features of defects.
|
Assessed defects Analysis method |
Misrun, Cold shut, Flow line, Oxide inclusion, Air inclusion Cold flakes |
Shrinkage Porosity Hot spot |
Erosion Soldering Crack |
Thermal Deformation | ||
|---|---|---|---|---|---|---|
| Solvers | Fluid Flow Analysis | Basic | ○ | - | ○ | ○ |
| Surface Tension | ◎ | - | ○ | ○ | ||
| Back Pressure | ◎ | - | ○ | ○ | ||
| Sleeve Analysis | ◎ | - | - | - | ||
| Solidification Analysis | Basic | - | ○ | ○ | ○ | |
| Basic | - | ◎Shrinkage, Porosity | ○ | ○ | ||
| Die Temperature Analysis | Die Temperature | - | ○ | ◎ | ○ | |
| CSM Die Temperature | - | - | ○ | - | ||
| Thermal Analysis | Heat Treatment | - | - | ○ | ○ | |
| Thermal Stress | - | - | ○ | ◎ | ||
○: Standard assessment ◎: Further assessment
